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SOM / CoM NXP SILICON

KARO TX93

PW-SOM-036

Partner manufacturer product — NXP i.MX 93

AI performance / NPU
0.5 TOPS
CPU cores
64-bit Armv8.2-A
Memory configuration
2GB
Memory / eMMC
2GB / 8GB

KARO TX93 is a SOM / CoM from KARO. SoC: NXP i.MX 93. Form factor: SODIMM (TX) (68 x 26 mm).

AI performance is 0.5 TOPS (INT8). Available configurations: 2GB memory and 8GB storage. Supported OS: Linux, Yocto, Debian, and FreeRTOS.

Intended applications include low-power IoT, industrial HMI, gateways, and industrial HMI / AR support. 9 other products use the same NXP i.MX 93, so you can compare by form factor and supplier.

What to check when selecting:

  • TSN support. If deterministic communication is a requirement, check the number of supported ports and the switch configuration

Positive ONE provides technical support. We also handle carrier board design and contract development.

Inquiries about this product

We welcome inquiries about technical specifications, pricing, lead time, and evaluation unit loans. We also handle carrier board design and contract development.

Configuration stage (implementation stage)

SOM implementation progresses in the order “module alone → mounted on a carrier board → enclosed”. The position of this product is shown below.

STEP 1
SOM only
System on Module
A core module that integrates the SoC, memory, and power supply. Used mounted on a carrier board.
This product is here
→
STEP 2
SOM + carrier board
Carrier / SBC / Evaluation board
A working board that carries the SOM and brings out external I/O (Ethernet, USB, video, power, etc.). For evaluation and integration.
→
STEP 3
SOM + carrier board + enclosure
Box PC / AI BOX / Edge server
Finished units with the board housed in an enclosure, designed for heat dissipation, dust protection, and installation. They can be installed and put into mass production as-is.
This product is STEP 1 (SOM only). It can be mounted on a carrier board for STEP 2 and housed in an enclosure for STEP 3. Positive ONE can support you end to end, including carrier board design and enclosure integration (contract development).

SILICON / SoC specifications

SoCNXP i.MX 93
Process16nm FinFET
CPU2x Arm Cortex-A55 @ 1.7GHz + Cortex-M33
GPUPXP 2D pixel pipeline
NPU / AIArm Ethos-U65 microNPU
AI performance0.5 TOPS (INT8)
DSP—
RAM typeLPDDR4 / LPDDR4X
RAM configuration2GB
StorageeMMC 5.1, SD / eMMC 8GB
Video decode—
Video encode—
ISPBasic parallel/CSI capture
Camera1x MIPI CSI-2
DisplayMIPI-DSI, parallel RGB, LVDS
Ethernet2x Gigabit Ethernet w/ TSN
PCIe—
USB2x USB 2.0
CAN2x CAN-FD
Operating temperature-25–85°C

Form factor / supply

CategorySOM / CoM
Form factorSODIMM (TX)
Dimensions68 x 26 mm
Part no.PW-SOM-036
Product nameKARO TX93
SupplierPartner manufacturer (KARO)
Supply typeSupplied by partner manufacturer
Characteristic tags
Low-powerEthos-UTSNCost-optimized
Main applications
Low-power IoTIndustrial controlSmart metersLightweight ML inference